Micro grain ‘Solution’ material specially engineered for small and delicate thin die Lower hardness of 62-65 HRC with tensile strength of 6.0 Gpa and flexural strength of 5.5 Gpa helps minimize cracked die problem.
Micro grain ‘Solution’ material specially engineered for small and delicate thin dieLower hardness of 62-65 HRC with tensile strength of 6.0 Gpa and flexural strength of 5.5 Gpa helps minimize cracked die problem.