Purpose – Printed flexible circuits that combined conventional silicon technology will enable the realisation of many value added products such as
smart packaging for the fast moving consumer goods (FMCG) industry. This paper aims to describe an investigation into integrating silicon and
printable circuits for the FMCG packaging industry and this would allow products with features such as brand protection, time temperature indicators,
customer feedback and visual product enhancement. Responding to interest from the FMCG packaging industry, an investigation was carried out which
investigated the printing conductive silver ink on common packaging substrates.