and 7.61%, respectively. As the particle MC increased, the dielectric loss factor of the mat was improved [37], thus the time of HF hot-pressing was shortened. However, higher MC absorbed too much energy during pressing, which had negative effects on adhesive curing. For example, at the particle MC of 14–18%, IB was reduced by 20%. Considering that the HF press was used in this study, the particle MC had to be well controlled to prevent the electrodes from being damaged [11]. Meanwhile, a high mat MC could lead to ignition phenomenon in the board. As a result, the MC should be controlled at 14% approximately.