The TiCxOy films were deposited by reactive dc magnetron sputtering, from a Ti target (200 × 100 mm2) with 12 cylindrical C pieces (10 mm diameter) embedded in its erosion zone. Films were deposited onto single-crystal silicon wafers with (100) orientation and glass substrates, previously ultrasonically cleaned and sputter etched for 15 min in an Ar atmosphere (pressure of 0.15 Pa). The depositions were carried out in a laboratory-size deposition system. A gas atmosphere composed of Ar + O2 was used. The Ar flow was kept constant at 60 sccm and the oxygen gas flow varied from 0 to 6 sccm (corresponding to a partial pressure variation between 0 and 5.1 × 10− 2 Pa). The working pressure was approximately constant at 0.4 Pa and the substrates were grounded.