Initially, single crystal silicon slices (n-type, ∼1 kΩ-cm resistivity, 25 mm diameter and 1 mm thickness) were cut from an ingot with the help of diamond wheel in a silicon wafer making machine.
Initially, single crystal silicon slices (n-type, ∼1 kΩ-cm resistivity, 25 mm diameter and 1 mm thickness) were cut from aningot with the help of diamond wheel in a silicon wafer making machine.