specially developed to shape and polish natural and polycrystalline diamond dies form 1.mm to 9.0mm, while maintaining accurate and consistent die geometry
Semi automatic needle grinding reduces each machining cycle to only a few seconds resulting in a marked improvement in accuracy and a significant saving in time compared to manual needle granding on a separate grinding machine
The feature makes the BD 500 ideal for repairing dies with accurate control of reduction, entrance and exit angles, greatly enhancing the performance of the wire drawing dies in operation
the oscillating die table allow it to perform mirror polishing and blending of the die profile with impressive results, this is praticularly important when repairing relatively coarse grain PCD dies blanks