Black multicrystalline silicon has been successfully
fabricated by plasma immersion ion implantation (PIII).
A defect removal etching (DRE) process with different
conditions has been taken subsequently. The height and
density of nanohills on the surface decrease with increase
in etching time. The surface reflectance of all the wafers
decreases with increase in height and density of nanohills.
All the wafers with different etching conditions have been
made for solar cells. The IQE of cells with a DRE process
shows a large improvement than that without a DRE
process, owing to decrease in surface recombination and
plasma etching defect. Besides, solar cells dealt with the
DRE process show a better performance than that without
theDRE process and that by acid textured solar cells. The
best performance of solar cells shows the conversion
efficiency, open circuit voltage and short circuit current
density as high as 17.46%, 623 mV and 35.99 mA/cm2
,
respectively, of which the condition of DRE process is
NaNO2/HF/H2O (6.4 g:10 ml:240 ml) with etching time of
20 min.
Black multicrystalline silicon has been successfullyfabricated by plasma immersion ion implantation (PIII).A defect removal etching (DRE) process with differentconditions has been taken subsequently. The height anddensity of nanohills on the surface decrease with increasein etching time. The surface reflectance of all the wafersdecreases with increase in height and density of nanohills.All the wafers with different etching conditions have beenmade for solar cells. The IQE of cells with a DRE processshows a large improvement than that without a DREprocess, owing to decrease in surface recombination andplasma etching defect. Besides, solar cells dealt with theDRE process show a better performance than that withouttheDRE process and that by acid textured solar cells. Thebest performance of solar cells shows the conversionefficiency, open circuit voltage and short circuit currentdensity as high as 17.46%, 623 mV and 35.99 mA/cm2,respectively, of which the condition of DRE process isNaNO2/HF/H2O (6.4 g:10 ml:240 ml) with etching time of20 min.
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