This lack of software support has relegated 3D printing of electronic devices to relatively simple circuits as routing and placement has been done by hand; however, the circuit designs that have been completed have achieved greater utilization of the available volume given the fabrication freedom offered by the manufacturing technology – with complex geometries easily fabricated in 3D. As an example, Fig. 1 shows a circuit design that utilizes all available surfaces of a pre-defined volume to accomplish layout of components. The routing has likewise utilized all available surfaces as well as the internal volume of the device. The original device was a signal conditioning circuit – the schematic of which was provided by engineers at NASA’s Johnson Space Center as a benchmark circuit in order to demonstrate the volumetric efficiencies of 3D printed electronics. The circuit volume was reduced to a volume of 0.5’’ by 0.5’’ by 0.125’’ as shown with a component and trace density of 27% significantly reduced from the original design.