Whilst thermal curing increases the cure rate and thus reduces the cure time, this is limited by the fact that the maximum rate of reaction for any given curing system is already determined at a constant temperature. Heating it at a higher temperature would not increase its rate of reaction, but instead lead to thermal degradation of the material. Particularly for the microelectronics/electronics industry, the curing of such thermoset systems has become the bottleneck of the whole production process. This paper reports on the alternative use of microwave curing to accelerate the rate of reaction and hence reduce the cure time.