Based on the predicted process model, it is possible to
identify how these control parameters affect bonding
performance and quality. Fig. 3 presents the relationship of
bonding temperature and power to the model response variables
of shear force and SBD. This surface model is obtained under
the parameter settings of bond time = 10ms, contact force =
45grams, ball size ratio = 2.4 and EFO gap = 14mils. In this
figure, shear force is at a minimum when the temperature and
power values are low, but increasing the temperature and power
values to 220°C and 80mw respectively, the shear force
increases quickly to a maximum (shown in Fig. 3a). The SBD
variable has the similar relationship as the shear force, except
that the power has more of an influence on the SBD than the
temperature does, as shown in Fig. 3b). Therefore a considerable
reduction in the SBD for minimal loss of bond shear strength
can be achieved by reducing the power setting during the
bonding process
Based on the predicted process model, it is possible toidentify how these control parameters affect bondingperformance and quality. Fig. 3 presents the relationship ofbonding temperature and power to the model response variablesof shear force and SBD. This surface model is obtained underthe parameter settings of bond time = 10ms, contact force =45grams, ball size ratio = 2.4 and EFO gap = 14mils. In thisfigure, shear force is at a minimum when the temperature andpower values are low, but increasing the temperature and powervalues to 220°C and 80mw respectively, the shear forceincreases quickly to a maximum (shown in Fig. 3a). The SBDvariable has the similar relationship as the shear force, exceptthat the power has more of an influence on the SBD than thetemperature does, as shown in Fig. 3b). Therefore a considerablereduction in the SBD for minimal loss of bond shear strengthcan be achieved by reducing the power setting during thebonding process
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