I. INTRODUCTION
The trend in wireless communication systems is to develop
a low profile antenna with lightweight, small size and low cost
with high performance. The widespread utilization of
microstrip antennas in these systems stems from their
simplicity, and their compatibility with millimeter wave and
microwave applications [1]. However, despite the advantages
microstrip patch antennas provide, they do have some
limitations that restrict their applications, such as inherently
narrow bandwidth low gain, spurious feed radiation and poor
polarization purity [2]. The task of designing a suitable antenna
for MMIC integration applications becomes much more
challenging [3-4]. Typically, MMIC substrate are electrically
thin, and of high dielectric constant. However, the many
limitations alluded to above have to be overcome in order to
design microstrip antennas at microwave or millimeter wave
frequencies on semiconductor substrates [5]. At millimeter
wave frequencies, additional issues have to be overcome in
order to design a microstrip antenna with acceptable
performance on high dielectric substrate such as small physical
size, amount of wafer space consumed and fabrication
tolerances [6]. Hence, major dilemmas still impeding the
creation of MMIC compatible antennas are small physical size
at high frequency, layer alignment in multi-layered antennas,
large amounts of space consumed on the MMIC wafer, etc d[7].
Thus, in this paper, we proposed examine novel methods for
integrating and constructing broadband microstrip antennas,
particularly at high microwave and millimeter wave
frequencies where dimensions get very small and fabrication
tolerances are critical.