TiN and TiC films were deposited by reactive rf magnetron sputtering, using high purity 99,999% titanium target and (N2 and CH4) reactive gases. The coatings were deposited on two types of substrates: polished quenched and tempered AISI H13 tool steel and (111) single crystal silicon. Tables 1 and 2 show the treatment conditions for obtaining TiN and TiC films, respectively. Substrate temperature was kept at 623 K, bias voltage was grounded and the power applied to the cathode magnetron was 500 W. Before deposition, the sputtering
chamber was evacuated to less than 10− 6 Torr (4.0 × 10− 4 Pa).
In all treatments a 200 to 400 nm Ti intermediate layer was deposited to improve adhesion [1–3].