[3]. This manufacturing process and the related ALD-grown materials have shown high quality in a wide range of applications from the catalysts to semiconductor chips, optical filters and beyond [4]. According to the needs of specified applications, a great variety of ALD process has been developed today. One of them is the depo- sition of Al2O3 high-k dielectric films to replace conventional SiO2 dielectric gate in the metal oxide semiconductor field effect tran- sistors [3,4]. In this ALD operation, trimethylaluminum (TMA) and water vapor (H2O) are the most often applied precursors, whichhave greatadvantages of volatilityand resistanceto thermal decomposition (<370 C) [5]. Numerous studies including system- atic measurements and quantum mechanical calculations have been performed on this TMA + H2O ALD process to study the underlying mechanisms, however, the complicated physicochemi- cal processes that control ALD operation and film growth are still not sufficiently understood yet [6]. A better control of this ALD process and related materials deposition requires a thorough
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