Fig. 1 shows the schematic of the proposed device and illustrates
the resistivity retaining and erasing processes. CNTs dispersed in the
PDMS polymer are aligned using the DEP technique. Conductive CNT
networks are formed above two microelectrodes patterned on a
silicon substrate. While applying an external force to the conductive
polymer, some of the conductive CNT networks are broken, resulting
in the increase of polymer resistivity. The resistivity is retained after the
external force is removed. Therefore, the maximum value of the applied
force can be measured (i.e., recorded) by the resistivity of the polymer.
Furthermore, by re-applying DEP to the electrode pair, the conductive
CNT networks in the polymer could be restructured, and the resistivity
can be recovered approximately to its original value (i.e., the value
before the external force was applied).
Fig. 1 shows the schematic of the proposed device and illustratesthe resistivity retaining and erasing processes. CNTs dispersed in thePDMS polymer are aligned using the DEP technique. Conductive CNTnetworks are formed above two microelectrodes patterned on asilicon substrate. While applying an external force to the conductivepolymer, some of the conductive CNT networks are broken, resultingin the increase of polymer resistivity. The resistivity is retained after theexternal force is removed. Therefore, the maximum value of the appliedforce can be measured (i.e., recorded) by the resistivity of the polymer.Furthermore, by re-applying DEP to the electrode pair, the conductiveCNT networks in the polymer could be restructured, and the resistivitycan be recovered approximately to its original value (i.e., the valuebefore the external force was applied).
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