・applicable process : electroless nickel plating
・used material: plating solution (Ni90~92%、P8~10%、below Pb 1000ppm)
・declarable substances : lead
・type of reaction: a very small amount of lead compound (which is added to stabilize a bath) goes into a film during reaction
Declarable substances specified by the management criteria of chemical substances in products may possibly be generated or remained exceeding the management criteria Example of concentration change, reaction process
・Polymerization (PVC: chemical reaction of vinyl chloride)
・Electroless nickel-plating process (lead: concentration change in plating solution)
・Ink. paint (lead, cadmium, etc. :change in concentration due to volatilization of solvent, etc.)
・Sealant agent (DBT, DOT: hardening reaction of two-component mixed type sealant)
"