For the purpose of increasing the number of die per wafer,
the street width tends to be narrower than before.
Accompanying this trend, it is required to change to a blade
thinner than the conventional one.
Meanwhile, the blade exposure amount, which directly
influences blade life, tends to be longer. Therefore,
depending upon blade thickness, if there is too much
exposure(Note 1), meandering can be seen due to
insufficient blade strength =(Figs. 5 and 6).