For these experiments 500 ppm of Ethylene gly-col (MW 3400) was used. Other additives were also utilizedsuch as bis (3-sulfopropyl) disulfide, and l-(2-hydroxyethyl)-2-imidazolidinethione, which have been used by others for copperelectrodeposition to produce smoother deposits [29]. It has beenreported that Bis-(3-sulfopropyl)-disulfide sodium salt improvetensile strength and hardness of copper deposits [29]. Effect of acti-vated polyacrylamide (APAM) on the surface morphology of copperwas also examined. It was reported that long duration electrowin-ning tests using APAM results in slightly columnar deposit whereas use of Gaur results in relatively small grains