Obviously, the causes of headaches are not manufacturing
line (CL or LPL) dependent but process (die bonding,
wire-bonding, molding, plating, trim–form
and test-mark) dependent.Workers are suffering from
headaches during the plating process, which involves
many types of chemicals. Some hydride gases used
in semiconductor manufacturing (e.g., arsine, phosphine)
are highly toxic. The insufficient air ventilation
to circulate the bad odors is another contributor to
headaches.The use of inhalation exposure control technology
has always been important in semiconductors
manufacturing. Workers are protected from the hazardous
production process by wearing personal protective
equipment (PPE), such as special clothing covering
the whole body (e.g., gowns), hair covers, shoe covers,
and, frequently, facial masks (or even air-supplied
breathing devices).
Obviously, the causes of headaches are not manufacturingline (CL or LPL) dependent but process (die bonding,wire-bonding, molding, plating, trim–formand test-mark) dependent.Workers are suffering fromheadaches during the plating process, which involvesmany types of chemicals. Some hydride gases usedin semiconductor manufacturing (e.g., arsine, phosphine)are highly toxic. The insufficient air ventilationto circulate the bad odors is another contributor toheadaches.The use of inhalation exposure control technologyhas always been important in semiconductorsmanufacturing. Workers are protected from the hazardousproduction process by wearing personal protectiveequipment (PPE), such as special clothing coveringthe whole body (e.g., gowns), hair covers, shoe covers,and, frequently, facial masks (or even air-suppliedbreathing devices).
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