Abstract — In this article we present an antenna array
concept in embedded wafer level ball grid array (eWLB)
package for mm-wave applications. The eWLB package has a
excellent performance for high frequency and the additional
fan-out area around the silicon chip enables the realization of
passives and antennas. Moreover, integration of the antenna in
package increases the efficiency and reduces cost. For some
applications a single antenna in package is unable to achieve the
required gain and directivity. Combining several antenna
elements as an array in a package can be a possible solution. A
two elements differential dipole antenna array in an 8 mm x
8 mm eWLB package at IMS (Industrial, Medical and Scientific)
band about 61 GHz is analyzed and successfully implemented. A
100 ȍ differential feeding system is designed for the array. The
measured reflection coefficient is -25 dB and the designed
antenna array has a gain of 11 dB and radiates in broadside.
Index Terms — Antenna in package, system in package, dipole
array, eWLB package, radar system, integrated antenna.