In this paper we describe a novel thermal characterization method of GaN-based Light Emitting Diode
(LED) package driven under the Alternating Current (AC) mode. The result was compared with the results
from the thermal analysis for LED package operated under the Direct Current (DC) condition. Different
from the DC condition, the junction temperature rise with the operation time of LED package was exhibited
in a band formation. Finite Volume Method (FVM) was utilized to calculate the thermal performance
of LED package under the AC condition using the input power extracted from the output current and voltage
from the AC power supply. The experimental result was in a good agreement with the simulation
data.
2011 El