An encapsulate or potting compound is a liquid resin system comprised of either one or two components that is poured over electrical and electronic components or circuit boards.
These encapsulating resins are designed for a variety of applications to protect the product including electrical insulation, environmental protection from moisture, water and chemicals and mechanical attack from thermal shock and vibration. This protection allows these electronics to be used in many more applications ensuring reliable, long-term performance.
This process can be done by several methods: potting, casting and encapsulation. Many names have been used interchangeably so there is some confusion of the terms. The most commonly used term is encapsulation or potting.