. A flow at the mesoscopic scale of the strand. In this mode, the
applied pressure results in a spreading of each strand. With this
squeezing, the gaps between strands reduce. This mechanism is
denoted as the inter-strand void content (ISVC) reduction. These
inter-strand voids have to reduce enough to prevent crack initiation
and dramatic strength property loss in the final part. This
later mechanism has been studied in a recent work [17]. An
analytical model to predict the ISVC for ROS flat panels under
various processing conditions and strands geometry has been
developed