Compositions comprising a mixture of an adhesive copolymer of ethylene and a monoolefinically unsaturated polar comonomer, for example, vinyl acetate, in combination with an olefin rubber, preferably a rubbery copolymer of ethylene and propylene, exhibit excellent adhesive properties, particularly when applied to non-porous surfaces such as metals. Creep resistance can be improved by lightly crosslinking the composition with radiation. Typically thermoplastic in nature, these compositions can be made thermosetting by including in the composition a heat activated crosslinking system. The compositions also exhibit resistance to blocking and flexibility at low temperatures.