Electromagnetic interference (EMI) shielding is receiving
increasing attention in electronic and communication
industries because of devices becoming increasingly sensitive,
dense and abundant. On the other hand, it is also
needed for deterring electromagnetic forms of spying [1–
3]. Composites with discontinuous and continuous conducting
fillers, such as metal fibers, metal flakes, carbon
particles and carbon fibers are widely used for EMI shielding
[4–7]. Most of these composites are not strong enough
for most structural applications [4]. So the traditional EMI
shielding materials such as permalloy, nickel and steel, etc.