The results presented in Fig. 2 show that, on the average, the tension values in the internal bond tests for the panels produced with ISB mixed to other particles are higher than the tension in the panels produced with bagasse. The mixture bagasse with pine particles show higher tension when compared to bagasse mixed with eucalyptus particles. The higher values of internal bond obtained when small particle was employed in the chipboard composition are directly attributed to a better compaction of the panels. Panels produced with ISB or SSB there have not shown any statistical difference for the internal bond values showing that the presence of sugar does not affect this important parameter.