For the MDI-bonded particleboards the lowest swelling was found for the spruce particleboards, while the highest thickness swelling was found for the sunflower particleboards.
All UF-bonded particleboards had similar swelling values, with exception for the cup-plant particleboards, which was
showing significantly higher thickness swell (20%, sig. p < 0.05).
Higher MDI dosages did not reduce TS2h for the particleboards made from spruce and sunflower. However, the higher MDI dosage significantly (sig. p < 0.05) reduced TS2h of the particleboards made with cup-plant particles. In contrast, the higher UF resin dosage significantly reduced thickness swelling of the spruce and cupplant particleboards.
The Higher UF dosage did not change TS2h of sunflower and topinambour particleboards.