The three main approaches to reduce component cost are SoC integration, SiP integration (the stacked-die solution), and PoP integration (the stacked package solution). System integration requires a complete system-level tradeoff analysis that involves the entire bill of materials and the architectures used for the communication system being designed. Determining the best set of trade-offs to attain the most cost-effective solution requires close collaboration from diverse engineering disciplines, including process integration engineers, circuit engineers, and system engineers.