This paper describes a technique for fabricating three-dimensional, metallic, pyramidal microstructures with base dimensions of 1−2 µm, wall
thicknesses of ∼100−200 nm, and tip-curvature radius of ∼50 nm. The procedure begins with the fabrication of pyramidal pits in the surface
of an n-doped silicon substrate. An electrically insulating surface layer of SiO2 covers the regions outside the pits. These pits are patterned
using either conventional photolithography or soft lithography and formed by selective anisotropic etching. The resulting topographically
patterned silicon serves as the cathode for the selective electrodeposition of metal in the py