There is a large thermal resistance
between the tip of the beam and the base of the beam where it is
attached to the device rim. Heat dissipated at the tip of the beam will
induce a temperature difference in the beam. Thermocouples (based
on the thermoelectric Seebeck effect whereby a temperature difference
at the junction of two metals creates an electrical voltage) or
transistors are employed to sense the temperature difference in the
device outputting an electrical signal proportional to the difference.
Recent advances in thermal sensor application to the “near surface
zone” of materials for assessing structural damage (referred to as
photo-thermal inspection) are reported by Goch et al.183 This review
covers other measurement techniques as well such as micromagnetic.