The heat storage capacity of these PS multilayer structures was
affected not only by the film multilayer structure, but also by the
storage time and temperature. The heat storage capacity decreased
in PS-multilayer systems stored at 25 C. PS multilayer structures
showed higher thermal buffering capacity for the longest
PCL/PCM deposition time and at chilling temperatures. The presence
of the additional PCL layer also improved the temperature
buffering capacity of these multilayer structures along storage.
These active packaging materials has a the thermal energy storage/
release capacity was of about 88–119 J/g.