The need for an objective measurement for determining solder
paste printability is highly applicable to today’s widespread
application of fine pitch design in SMT [5]. Laser triangulation
can be effectively used to determine printability in solder paste.
The slump characteristics as a result of time, temperature or
humidity can be quantified. Surface topography of bare boards
coupled with the ability to perform virtual or nondestructive
cross sections can be a basis for printing process improvements
and stencil aperture fine tuning. Effects on printability of
variations in material formulation elements such as powder
size and flux rheology are measurable. Suitability of solder
paste design can be accurately assessed by both material
formulators and users by objectively measuring key functional
parameters. This fundamental capability allows SMT material
manufactures to access the suitability of their materials for
today’s challenging market.