Molecular dynamics simulation was performed in order to investigate the dependence of void growth on
crystallographic orientation at the triple junction of grain boundaries in nanoscale tricrystal nickel film
subjected to uniaxial tensile loading. The nucleation, the emission and the transmission of Shockley
partial dislocations play a predominant role in the growth of void at the triple junction of grain
boundaries. The orientation factors of various slip systems are calculated according to Schmid law