Kushiya et al. [58] proposed a simple and low-cost reuse and recycling process for Cu(InGa)Se2(CIGS)-based thin-film modules. The process consists of mechanical separation of cover glass after heating the module below 250 °C to soften the EVA, removal of residual EVA by immersing in an acetic acid solution, collection of CIGS-based absorber part as metal powder by mechanical scribing techniques and recovery of the soda-lime back glass by dissolving the MO layer with a diluted nitric acid solution.