This paper presents new experimental and numerical methods to characterize the transfer overmolding
of substrates with epoxy polymer. We investigated Multi Chip Modules on ceramic panels as well as on
printed circuit boards encapsulated as a Mold Array Package (MAP). Experiments show that the polymer
flow during the overmolding process depends significantly on the mold height: While standard MAP-type
mold cavities are filled homogeneously and symmetrically in most cases, low cavity heights (