Boron nitride (BN) has a similar plate structure to graphite
and thus superior thermal conductivity, but it is a nonconductor of electricity(Yung and Liem, 2007). BN has been studied extensively as a filler to improve the thermal conductivity
of a variety of polymer-based composite systems, most often
in epoxy composite systems, which are applied to the packaging of electronic parts such as PCBs and EMCs(Lee et al.,
2006; Nagai and Lai, 1997; Yung et al., 2006).