the bond shear reduces because the high bond power agitate the newly formed intermetallic layer and breaks it. TItis cycle of fonning intennetallic layer, break it and refonning again weaken the Al to Au surface on the leadframe and cermnic substrate
the bond shear reduces because the high bond power agitate the newlyformed intermetallic layer and breaks it. TItis cycle offonning intennetallic layer, break it and refonningagain weaken the Al to Au surface on the leadframe andcermnic substrate