thresholds. If an FCLK change is desired, the PLL is re-locked
to a new divide ratio and recovery cycles are monitored at the
new FCLK value, potentially requiring multiple PLL changes to
achieve the optimum FCLK. In contrast, adaptation with DVM
enables a direct transition to the optimum FCLK by changing
the PLL divide ratio once. In comparison to using voltage and
thermal sensors with corresponding look-up tables to map
voltage or temperature settings to delay, the DVM
significantly reduces the design complexity by mapping
multiple dynamic variations into a single FCLK change.
Combining resilient circuits with dynamic adaptation allows
the microprocessor to ad