1) Sidewall Delam Induced Substrate Trace Crack: Failures were observed at EAC via open post TC-B 500 cycles. Failure analysis showed a trace crack on a build-up layer induced from the propagation of sidewall delamination at EAC/cavity interface. Fig. 14(a) shows the trace crack exposed by planar grinding.Fig.14(b)shows sidewall delamination between EAC and cavity, which had propagated to buildup layer to induce the trace crack. Fig. 15 shows a substrate failing at similar EAC serpentin estructure in the substrate after TC-B500 cycles. Sidewall delamination in this case went from corner of EAC to 5F layer.