One of the causes for rougher electrodeposits is the development of an unstable interface front [31]. Another aspect is an
effect of chloride anions on the electrode surface as well as an attractive interaction between chloride and copper ions, which
can result in formation of local structures [31–33]. In these structures, ionic species can be adsorbed easily. It should be noted that diffusion characteristics of additives are different in chloride and sulfate media. It also causes a difference in bottom up filling as well as conformal growth, which results in different surface quality.