Semi-Insulating Polycrystalline Silicon (SIPOS) films were deposited on Si02/Si, Si, and sapphire
substrates by the chemical vapor deposition of silane and nitroiJs oxide at atmospheric and low
pressures.X -ray diffraction wasu sedt o identify the phasesp resent, and to study structural properties
like grain size ands train as a function of the flow rate ratio, ~, = [N20]/[SiH4].oBothA PCVaDn dL PCVD
films containeda toleast four phases: polycrystallines ilicon (grain size > 300A ), microcrystallines ilicon
(grain size 15-25A ), amorphoussil icon (grain size < 9 A), anda n additional phase,a s yet unidentified,
termed SixOy. The Si(222) reflection was observed, which is forbidden for crystalline silicon. SIPOS
depositedo n sapphirea ppearedto havea different structure than that depositedo n Si02/Si or on Si.
Grain size decreasedw ith increasing -y. As-depositedfi lms were either unstrainedo r in compression.
No major structural differences were observedb etweenA PCVaDn d LPCVDfil ms. On annealing at 550 -
750 o C, the SilO. phasea nd amorphousi licon disappeared.T he intensity of the forbidden Si(222)
reflection decre^as~ed with increasing annealing temperature. No grain growth was observed on
annealing. Strain changedfr om compressivet o tensile on annealing. The texture of the films was
investigated by the pole figure technique and was found to be different for films deposited on sapphire
substrates as comparetdo films depositedo n Si02/Si. The texture also dependedst rongly on the value
of ,/. A structural modelw asp roposedto explain the origin of the forbidden Si(222) reflection. Major
contributionsa re that this is the first observationo f the Si(222)r eflection andt he SixOyp hase
Semi-Insulating Polycrystalline Silicon (SIPOS) films were deposited on Si02/Si, Si, and sapphiresubstrates by the chemical vapor deposition of silane and nitroiJs oxide at atmospheric and lowpressures.X -ray diffraction wasu sedt o identify the phasesp resent, and to study structural propertieslike grain size ands train as a function of the flow rate ratio, ~, = [N20]/[SiH4].oBothA PCVaDn dL PCVDfilms containeda toleast four phases: polycrystallines ilicon (grain size > 300A ), microcrystallines ilicon(grain size 15-25A ), amorphoussil icon (grain size < 9 A), anda n additional phase,a s yet unidentified,termed SixOy. The Si(222) reflection was observed, which is forbidden for crystalline silicon. SIPOSdepositedo n sapphirea ppearedto havea different structure than that depositedo n Si02/Si or on Si.Grain size decreasedw ith increasing -y. As-depositedfi lms were either unstrainedo r in compression.No major structural differences were observedb etweenA PCVaDn d LPCVDfil ms. On annealing at 550 -750 o C, the SilO. phasea nd amorphousi licon disappeared.T he intensity of the forbidden Si(222)reflection decre^as~ed with increasing annealing temperature. No grain growth was observed onannealing. Strain changedfr om compressivet o tensile on annealing. The texture of the films wasinvestigated by the pole figure technique and was found to be different for films deposited on sapphiresubstrates as comparetdo films depositedo n Si02/Si. The texture also dependedst rongly on the valueof ,/. A structural modelw asp roposedto explain the origin of the forbidden Si(222) reflection. Majorcontributionsa re that this is the first observationo f the Si(222)r eflection andt he SixOyp hase
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