It is the supplier’s responsibility to identify the plating thickness distribution for each unique part. In order to consistently meet the specified minimum plating thickness on all significant surfaces, plating racks may be required to em-ploy many special processing techniques, e.g., the use of auxiliary anodes and/or shields, reducing the number of parts per rack etc.
The plating thickness shall be determined by the microsection method (ISO 1463) or coulometric method (ISO 2177). In case of disagreements between purchaser and supplier, the microsection method shall be the preferred method for Ni and Cu layers. X-Ray (ISO 3497) may be used but usage may be limited to chrome layer thickness if Copper and Nickel layer thickness is too high.