Scope
This document submits the general technical requirements for Printed Circuit Board manufacturing. It describes the minimum
conditions under which Panels and Unitary PCB have to be manufactured, tested, controlled, packaged and delivered to the
final assembly plan.
Any technical requirement hereunder described is to be taken into account prior to standard requirements (IPC, ISO, etc.).
If any technical condition came not to be defined, the standard requirements at its last index are to be followed.