Microelectronic devices and sensors made for rugged
operation with higher thermal operating limits are in demand.
Electronics with the ability to effectively function
in harsh environments will enable advancements in a
wide range of industries and new clean energy markets.
Potential applications are numerous and can be found in
the automotive, aerospace, metals processing, power
generation, down-hole instrumentation, chemical-petrochemical
processing and fuel cells. However, many technological
challenges need to be addressed to allow the
development of electronic systems capable of operating
at temperatures greater than 570K for long periods of
time and in harsh conditions. One of these challenges
is developing suitable hermetic packages. Severe thermal
conditions limit the possibilities to only a select few
materials. Silicon carbide (SiC) has many properties that
make it a potential candidate for the package body.