A method for determining the printability of a
solder paste has been developed using laser triangulation based
sensor hardware.The noncontact attribute of this measurement
method is ideal for wet print measurements. The effect on
material printability of both formulation and process elements
are discussed. Results indicate that powder size has a definite
and significant effect on the printability of the solder paste for
20 mil pitch applications. Bare board outer layer anomalies are
characterized by surface scans and virtual cross sections.