Although liquid cooling systems have the shortcomings of bulky
equipment and coolant leakage, they have excellent heat dissipation performance. With the development of nanotechnology, adding nanoparticles to the traditional working fluid to form
nanofluids for heat dissipation has become a popular research
direction in recent years. Nanofluids with better suspension have
superior thermal conductivity and thermal convection performance, significantly reducing the volume of the liquid cooling system and improving its thermal performance [5–11]. A number of
researchers have used nanofluids in small heat exchangers or
microchannel heat sinks (MCHSs) to remove heat from electronic
chips or small-scale local heating elements. Results show that
nanofluids can effectively enhance the convective heat transfer
coefficient of a heat exchanger [5,7,9,11]. Therefore, nanofluids
have great potential for cooling electronic chips