The fitting for silver and copper are represented in Fig. 7.
We deduce from these profiles diffusion coefficients DCu=
0.104 μm2/s for copper and DAg=0.00183 μm2/s for silver, however
these results must be minimized, classical model does not seem sufficient
to take account another elements presence beyond 80 μm forcopper and 12 μm for silver. Rediffusion can here occur due to high
thermal condition with a temperature T>660 °C up to the Tg value
of the glass. Another cause is the non-infinite medium conditions of
the deposited enameling. This condition leads to different exchange
kinetics than in lower temperature case T=450 °C where classical
diffusion law can be used (Eqs. (3) and (4)). In a previous experiment,
we have detailed the diffusion coefficient in lower conditions in an
elastic regime (solid) [22].