Melt-laminates of wood/natural rubber (wood/NR) composite and ethylene-propylene diene rubber
(EPDM) foam were prepared by compression molding technique. Two different forms of 4,40
oxybis(benzenesulfonylhydrazide)
(OBSH) blowing agent were used; pure OBSH (designated as OBSH) and ethylenepropylene
bound OBSH (designated as EPR–b-OBSH). The effect of the OBSH concentration on the cell
structures and mechanical properties of EPDM foam, and the peel strength and thermal conductivity
of wood/NR composite–foamed EPDM laminates was examined. It was found that the EPR–b-OBSH gave
EPDM foam with greater number of cell structures, higher porosities and resistances to water penetration
on the foam surface. However, the EPDM with EPR–b-OBSH agent had worse elastic recovery as compared
to that with OBSH due to deformation of cell structures after prolonged compression loading. The recommended
concentrations for EPR–b-OBSH and OBSH blowing agents were 3.0 and 5.0 phr, respectively, for
the optimum interfacial adhesion and low thermal conductivity.
20
Melt-laminates of wood/natural rubber (wood/NR) composite and ethylene-propylene diene rubber(EPDM) foam were prepared by compression molding technique. Two different forms of 4,40oxybis(benzenesulfonylhydrazide)(OBSH) blowing agent were used; pure OBSH (designated as OBSH) and ethylenepropylenebound OBSH (designated as EPR–b-OBSH). The effect of the OBSH concentration on the cellstructures and mechanical properties of EPDM foam, and the peel strength and thermal conductivityof wood/NR composite–foamed EPDM laminates was examined. It was found that the EPR–b-OBSH gaveEPDM foam with greater number of cell structures, higher porosities and resistances to water penetrationon the foam surface. However, the EPDM with EPR–b-OBSH agent had worse elastic recovery as comparedto that with OBSH due to deformation of cell structures after prolonged compression loading. The recommendedconcentrations for EPR–b-OBSH and OBSH blowing agents were 3.0 and 5.0 phr, respectively, forthe optimum interfacial adhesion and low thermal conductivity. 20
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