The workable parameters for ceramic
substrate bonding from analyze phase were applied
in this process. Another area of improvement was
done on the nozzle design to enlarge the area of
pick up such as in figure. With the new design
collet, the nozzle can hold the ceIaInic substrate
during the attach process. Fig. 13 illustrates the
change of the collet design. The change of the
collet design improves dramatically the placement