A framework is proposed for the maintenance and
service of semiconductor equipment. The proposed framework
consists of a system of equipment failure analysis, methods,
process, and activities, and a procedure in maintenance and
service. The maintenance procedure is constructed by integrating
value engineering, quality function deployment, mechatronics
engineering, technique from R&D and supplier, and Taguchi
method with axiomatic design mapping. The ultimate value of
maintenance management of a wire bonder machine, K&S
(Kulicke and Soffa) Maxμm Plus, in the first bond failure is
illustrated.