This article investigates the thermal performance of a thermoelectric water-cooling device for electronic
equipment. The influences of heat load and the thermoelectric cooler's current on the cooling performance of
the thermoelectric device are experimentally and theoretically determined. This study develops a novel
analytical model of thermal analogy network to predict the thermal capability of the thermoelectric device.
The model's prediction agrees well with the experimental data. The experimental result shows that when
heat load increases from 20 W to 100 W, the lowest overall thermal indicator increases from−0.75 KW
−1
to
0.62 KW
−1
at the optimal electric current of 7 A. Besides, this study verifies that the thermal performance of
the conventional water-cooling device can be effectively enhanced by integrating it with the thermoelectric
cooler when the heat load is below 57 W